Characteristics and classification of circuit board

PCB features high density, high reliability, designability, producibility, assemblability and maintainability.

Generally speaking, the more complex the function of electronic products, the longer the loop distance and the more pins of contacts, the more layers required for PCB, such as high-level consumer electronics, information and communication products, etc.; and softboards are mainly used in products that need bending, such as notebook computers, cameras, automotive instruments, etc. According to the number of layers, PCB can be divided into single panel (SSB), double-sided board (DSB) and multi-layer board (MLB); according to the flexibility, PCB can be divided into rigid printed circuit board (RPC) and flexible printed circuit board (FPC). In the industry research, generally according to the basic classification of PCB products mentioned above, the PCB industry is divided into six major sub industries: single panel, double-sided board, conventional multilayer board, flexible board, HDI (high-density sintering) board and packaging substrate.

The upstream industry of PCB includes the suppliers of raw materials for PCB substrate and PCB production equipment, while the downstream industry includes consumer electronics, computer and peripheral products, automobile industry and mobile phone industry. According to the industrial chain can be divided into raw materials - copper clad laminate - printed circuit board - electronic products applications. The specific analysis is as follows:

Glass fiber cloth: glass fiber cloth is one of the raw materials of copper clad laminate. It is made of glass fiber yarn, accounting for 40% (thick plate) and 25% (thin plate) of the cost of copper clad laminate. Glass fiber yarn is made of silica sand and other raw materials calcined into liquid state in the kiln, drawn into very fine glass fiber through a very small alloy nozzle, and then hundreds of glass fibers are twisted into glass fiber yarn.

Copper foil: copper foil accounts for the largest proportion of the cost of copper clad laminate, accounting for about 30% (thick plate) and 50% (thin plate) of the cost of copper clad laminate. Therefore, the price rise of copper foil is the main driving force of the price rise of copper clad laminate.

Copper clad laminate: copper clad laminate is the product of glass fiber cloth and copper foil pressed together with epoxy resin as fusion agent. It is the direct raw material of PCB, and is made into printed circuit board after etching, electroplating and multilayer board pressing. Warm tips: Huaqiang PCB is a professional PCB manufacturer in China. For more details, please visit Huaqiang PCB.